电子科学与技术专业英语 光电信息技术分册（修订版）

Chapter 1 Semiconductors Physics
    1．1 Energy Bands and Carrier Concentration
    1．2 Carrier Transport Phenomena
    1．3 PN Junction
    1．4 Summary
    参考文献
Chapter 2 Semiconductor Device
    2．1  Bipolar Junction Transistor
    2．2 The MOSFET
    2．3 Microwave and Photonic Devices  
    2．4 Stamary
    参考文献
Chapter 3 Processing Technology
    3．1 Crystal Growth and Epitaxy  
    3．2 Crystal Growth from the Melt
    3．3 Vapor-Phase Epitaxy
    3．4 Oxidation and Film Deposition  
    3．5 Diffusion and Ion Implantation  
    3．6 Lithographies
    3．7 Wet Chemical Etching  
    3．8 Dry Etching
    3．9 Integrated Devices
    3．10 Fundamental Limits of Integrated Devices
  参考文献
Chapter 4 Integrated Circuits
    4．1 Introduction  
    4．2 Design Analysis and Simulation
    4．3 Vedficafion
    4．4 Summary
    参考文献
Chapter 5 Microelectromechanical Systems(MEM)
    5．1 Introduction  
    5．2 MEMS  
    5．3 Mechanical Characteristics of Silicon
    5．4 Microfabrications for MEMS  
    5．5 Micmsensing for MEMS
    5．6 Electromechanical Actuation
    5．7 Materials for MEMS  
    参考文献
Chapter 6 Examples of Scientific and Technological Papers
    6．1 The Challenges for Physical Limitations in si Microelectronics
    6．2 Micmelectronics and Photonics—the Future
    6．3 Accelerated Verification of Digital Devices Using VHDL
    6．4 What Is Nanotechnology
  参考文献