Mems And Microsystems: Design, Manufacture, And Nanoscale Engineering, Second Edition 9780470083017pdf/txt下载_在线阅读全文

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　　Technology/Engineering/Mechanical
　　A bestselling MEMS text...now better than ever.
　　An engineering design approach to Microelectromechanical Systems, MEMS and Microsystems remains the only available text to cover both the electrical and the mechanical aspects of the technology. In the five years since the publication of the first edition, there have been significant changes in the science and technology of miniaturization, including microsystems technology and nanotechnology. In response to the increasing needs of engineers to acquire basic knowledge and experience in these areas, this popular text has been carefully updated, including an entirely new section on the introduction of nanoscale engineering.
　　Following a brief introduction to the history and evolution of nanotechnology, the author covers the fundamentals in the engineering design of nanostructures, including fabrication techniques for producing nanoproducts, engineering design principles in molecular dynamics, and fluid flows and heat transmission in nanoscale substances.
　　Other highlights of the Second Edition include:
　　Expanded coverage of microfabrication plus assembly and packaging technologies
　　The introduction of microgyroscopes, miniature microphones, and heat pipes
　　Design methodologies for thermally actuated multilayered device components
　　The use of popular SU-8 polymer material
　　Supported by numerous examples, case studies, and applied problems to facilitate understanding and real-world application, the Second Edition will be of significant value for both professionals and senior-level mechanical or electrical engineering students.

内容简介

Technology/Engineering/Mechanical 
　　A bestselling MEMS text...now better than ever. 
　　An engineering design approach to Microelectromechanical Systems,
MEMS and Microsystems remains the only available text to cover both
the electrical and the mechanical aspects of the technology. In the
five years since the publication of the first edition, there have
been significant changes in the science and technology of
miniaturization, including microsystems technology and
nanotechnology. In response to the increasing needs of engineers to
acquire basic knowledge and experience in these areas, this popular
text has been carefully updated, including an entirely new section
on the introduction of nanoscale engineering. 
　　Following a brief introduction to the history and evolution of
nanotechnology, the author covers the fundamentals in the
engineering design of nanostructures, including fabrication
techniques for producing nanoproducts, engineering design
principles in molecular dynamics, and fluid flows and heat
transmission in nanoscale substances. 
　　Other highlights of the Second Edition include: 
　　Expanded coverage of microfabrication plus assembly and packaging
technologies 
　　The introduction of microgyroscopes, miniature microphones, and
heat pipes 
　　Design methodologies for thermally actuated multilayered device
components 
　　The use of popular SU–8 polymer material 
　　Supported by numerous examples, case studies, and applied
problems to facilitate understanding and real–world application,
the Second Edition will be of significant value for both
professionals and senior–level mechanical or electrical engineering
students.

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作者简介

　　Tai–Ran Hsu, PhD, is a Professor in the Department of Mechanical and Aerospace Engineering, San Jose State University, California. Dr. Hsu is the author of the earlier edition of this book, which is considered one of the bestselling textbooks on the subject of MEMS.

目　　录

Preface
Chapter 1: Overview of MEMS and Microsystems
　1.1 MEMS and Microsystem
　1.2 Typical MEMS and Microsystems Products
　1.3 Evolution of Microfabrication
　1.4 Microsystems and Microelectronics
　1.5 The Multidisciplinary Nature of Microsystems Design andManufacture
　1.6 Microsystems and Miniaturization
　1.7 Application of Microsystems in Automotive Industry
　1.8 Application of Microsystems in Other Industries
　1.9 Markets for Microsystems
　Problems
Chapter 2: Working Principles of Microsystems
　2.1 Introduction

Preface 
Chapter  1: Overview of MEMS and Microsystems 
　1.1 MEMS and Microsystem 
　1.2 Typical MEMS and Microsystems Products 
　1.3 Evolution of Microfabrication 
　1.4 Microsystems and Microelectronics 
　1.5 The Multidisciplinary Nature of Microsystems Design and
Manufacture 
　1.6 Microsystems and Miniaturization 
　1.7 Application of Microsystems in Automotive Industry 
　1.8 Application of Microsystems in Other Industries 
　1.9 Markets for Microsystems 
　Problems 
Chapter  2: Working Principles of Microsystems 
　2.1 Introduction 
　2.2 Microsensors 
　2.3 Microactuation 
　2.4 MEMS with Microactuators 
　2.5 Microaccelerometers 
　2.6 Microfluidics 
　Problems 
Chapter  3: Engineering Science for Microsystems Design and
Fabrication 
　3.1 Introduction 
　3.2 Atomic Structure of Matters 
　3.3 Ions and Ionization 
　3.4 Molecular Theory of Matter and Inter-molecular Forces 
　3.5 Doping of Semiconductors 
　3.6 The Diffusion Process 
　3.7 Plasma Physics 
　3.8 Electrochemistry 
　Problems 
Chapter  4: Engineering Mechanics for Microsystems
Design 
　4.1 Introduction 
　4.2 Static Bending of Thin Plates 
　4.3 Mechanical Vibration 
　4.4 Thermomechanics 
　4.5 Fracture Mechanics 
　4.6 Thin Film Mechanics 
　4.7 Overview on Finite Element Stress Analysis 
　Problems 
Chapter  5: Thermofluid Engineering and Microsystems
Design 
　5.1 Introduction 
　5.2 Overview on the Basics of Fluid Mechanics in Macro and
Mesoscales 
　5.3 Basic Equations in Continuum Fluid Dynamics 
　5.4 Laminar Fluid Flow in Circular Conduits 
　5.5 Computational Fluid Dynamics 
　5.6 Incompressible Fluid Flow in Microconduits 
　5.7 Overview on Heat Conduction in Solids 
　5.8 Heat Conduction in Multi-layered Thin Films 
　5.9 Heat Conduction in Solids in Submicrometer Scale 
　Problems 
Chapter  6: Scaling Laws in Miniaturization 
　6.1 Introduction to Scaling 
　6.2 Scaling in Geometry 
　6.3 Scaling in Rigid-Body Dynamics 
　6.4 Scaling in Electrostatic Forces 
　6.5 Scaling of Electromagnetic Forces 
　6.6 Scaling in Electricity 
　6.7 Scaling in Fluid Mechanics 
　6.8 Scaling in Heat Transfer 
　Problems 
Chapter  7: Materials for MEMS and Microsystems 
　7.1 Introduction 
　7.2 Substrates and Wafers 
　7.3 Active Substrate Materials 
　7.4 Silicon as a Substrate Material 
　7.5 Silicon Compounds 
　7.6 Silicon Piezoresistors 
　7.7 Gallium Arsenide 
　7.8 Quartz 
　7.9 Piezoelectric Crystals 
　7.10 Polymers 
　7.11 Packaging Materials 
　Problems 
Chapter  8: Microsystems Fabrication Processes 
　8.1 Introduction 
　8.2 Photolithography 
　8.3 Ion Implantation 
　8.4 Diffusion 
　8.5 Oxidation 
　8.6 Chemical Vapor Deposition 
　8.7 Physical Vapor Deposition - Sputtering 
　8.8 Deposition by Epitaxy 
　8.9 Etching 
　8.10 Summary of Microfabrication 
　Problems 
Chapter  9: Overview of Micromanufacturing 
　9.1 Introduction 
　9.2 Bulk Micromanufacturing 
　9.3 Surface Micromachining 
　9.4 The LIGA Process 
　9.5 Summary on Micromanufacturing 
　Problems 
Chapter  10: Microsystem Design 
　10.1 Introduction 
　10.2 Design Considerations 
　10.3 Process Design 
　10.4 Mechanical Design 
　10.5 Mechanical Design Using Finite Element Method 
　10.6 Design of Silicon Die of a Micropressure Sensor 
　10.7 Design of Microfluidics Network Systems 
　10.8 Computer-Aided Design 
　Problems 
Chapter  11: Assembly, Packaging and Testing of
Microsystems 
　11.1 Introduction 
　11.2 Overview of Microassembly 
　11.3 The High Costs of Microassembly 
　11.4 Microassembly Processes 
　11.5 Major Technical Problems in Microassembly 
　11.6 Microassembly Work Cells 
　11.7 Challenging Issues in Microassembly 
　11.8 Overview of Microsystems Packaging 
　11.9 General Considerations in Packaging Design 
　11.10 The Three Levels of Microsystems Packaging 
　11.11 Interfaces in Microsystems Packaging 
　11.12 Essential Packaging Technologies 
　11.13 Die preparation 
　11.14 Surface Bonding 
　11.15 Wire bonding: 
　11.16 Sealing and Encapsulation 
　11.17 Three-dimensional Packaging 
　11.18 Selection of Packaging Materials 
　11.19 Signal Mapping and Transduction 
　11.20 Design Case on Pressure Sensor Packaging 
　11.21 Reliability in MEMS Packaging 
　11.22 Testing for Reliability 
　Problems 
Chapter  12: Introduction to Nanoscale Engineering 
　12.1 Introduction 
　12.2 Micro and Nanoscale Technologies 
　12.3 General Principle in Nanofabrication 
　12.4 Nanoproducts 
　12.5 Applications of Nanoproducts 
　12.6 Quantum Physics 
　12.7 Molecular Dynamics 
　12.8 Fluid Flow in Submicrometer and Nano Scales 
　12.9 Heat Conduction in Nanoscale 
　12.10 Measurement of Thermal Conductivity 
　12.11 Challenges in Nanoscale Engineering 
　12.12 Social Impacts of Nanoscale Engineering 
　Problems 
　Bibliography 
　Index.

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